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    NXP Semiconductors BYC10-600 Hyperfast power diode BYC10-600 All information provided in this document is subject to legal disclaimers. ? NXP B.V. 2013. All rights reserved Product data sheet 27 May 2013 6 / 9 10. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD59 2-lead TO-220AC sod059_po 09-08-25 12-11-27 Unit mm max nom min 4.7 4.3 1.40 1.15 1.7 1.3 0.65 0.45 15.8 15.6 6.8 6.4 10.30 5.08 16.25 15.0 9.65 (REF) 15.70 12.5 3.80 3.65 A Dimensions Note 1. Protruded dambar are included in the dimension. Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC SOD59 A1 b 0.95 0.70 b1(1) c D D1 E e H L P Q 2.6 2.2 q 2.9 2.7 0 5 10 mm scale c A1 A Q e q H b1 b 2 1 D1 D P E L Fig. 8. Package outline TO-220AC (SOD59) |